Lam Research Corporation

Lam Research Corporation

LRCX
Lam Research CorporationUS flagNASDAQ Global Select
351.41
USD
-39.85
- -
439.46BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
2.13
2.8
3.29
3.7
4.94
6.85
6.33
6.94
10.18
12.31
12.87
11.34
14.33
17.2
Basic EPS, GAAP
0.07
0.38
0.41
0.58
1.05
1.47
1.44
1.55
2.72
3.29
3.33
2.91
4.17
5.32
Free Cash Flow per Basic Share
0.43
0.44
0.49
0.85
1.25
1.64
2.08
1.47
2.5
2.22
3.82
3.54
4.8
5.52
Dividend per Share
- -
- -
0.07
0.12
0.15
0.19
0.44
0.45
0.51
0.58
0.67
0.78
0.89
0.98
Book Value per Share
1.76
2.17
2.57
3.03
3.85
5.11
6.51
7.96
10.23
13.19
16.26
18.88
22.54
26.17
Tangible Book Value per Share
1.27
1.73
2.02
2.61
3.2
2.96
1.98
2.44
3.07
3.33
4.74
5.16
6.26
6.9
Basic Weighted Avg Shares
1,689
1,647
1,596
1,589
1,622
1,616
1,525
1,448
1,436
1,399
1,355
1,314
1,286
1,261
Sales/Revenue/Turnover
3,599
4,607
5,259
5,886
8,014
11,077
9,654
10,045
14,626
17,227
17,429
14,905
18,436
21,682
Operating Margin (%)
3.28
14.71
16.49
18.25
23.74
29.01
25.53
26.62
30.64
31.24
29.93
28.73
32.01
34.26
Depreciation Expense
304
292
278
291
307
326
309
269
307
334
342
360
386
420
Net Income, GAAP
114
632
656
914
1,698
2,381
2,191
2,252
3,908
4,605
4,511
3,828
5,358
6,708
Effective Tax Rate (%)
- -
12.59
11.51
4.8
6.29
24.47
10.43
12.55
10.58
11.32
11.71
12.21
10.07
10.39
Profit Margin (%)
3.16
13.72
12.47
15.53
21.19
21.49
22.7
22.42
26.72
26.73
25.88
25.68
29.06
30.94
Working Capital
2,389
3,202
3,639
6,795
6,192
6,000
6,189
7,691
8,125
7,720
9,043
8,545
7,949
8,055
LT Debt
789
817
1,001
3,378
1,785
1,807
3,823
4,971
4,984
4,998
5,003
4,479
3,730
3,730
Total Equity
4,676
5,213
5,345
6,102
6,987
6,580
4,723
5,183
6,027
6,278
8,210
8,539
9,862
10,585
Return on Invested Capital (%)
- -
9.36
10.67
11.2
17.57
25.62
23.95
22.85
35.52
41.3
36.24
27.46
37.13
46.22
Return on Capital (%)
- -
14.94
12.68
13.36
19.99
25.02
18.3
15.16
22.13
22.11
18.52
14.04
17.44
19.94
Return on Common Equity (%)
3.91
19.31
17.09
20.5
30.67
32.81
24.09
20.99
29.83
27.79
22.28
16.34
19.92
22.15

Capital Structure

FRC

in mil. unless spec.
Sep'26
Dec'26
Mar'26
ST Debt
754
754
4
LT Borrowings
3,730
3,730
3,730
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,259
1,251
1,251
Market Capitalization
171,044
217,286
269,388

Working Capital

FRC

in mil. unless spec.
Sep'26
Dec'26
Mar'26
Total Current Assets
14,807
14,018
13,297
Cash, Cash Equivalents & STI
6,693
6,180
4,751
Accounts Receivable, Net
3,633
3,492
4,133
Inventories
4,095
4,038
4,000
Total Current Liabilities
6,708
6,213
5,242
Payables & Accruals
1,652
1,571
1,586
ST Debt
754
754
4
Deferred Revenue
2,646
2,165
2,091

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
7.51%
14.14%
15.48%
Free Cash Flow
28.43%
28.95%
32.69%
Net Income, GAAP
27.44%
22.84%
39.98%
Sales/Revenue/Turnover
15.12%
14.75%
23.68%
Total Cash Common Dividend
29.49%
11.85%
12.82%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3,482
3,758
3,794
3,872
14,905
2025
4,168
4,376
4,720
5,171
18,436
2026
5,324
5,345
5,841
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.67
0.72
0.74
0.78
2.91
2025
0.86
0.93
1.04
1.35
4.17
2026
1.24
1.27
1.46
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.17
0.2
0.2
0.2
0.78
2025
0.2
0.23
0.23
0.23
0.89
2026
0.23
0.26
0.26
- -
- -

Company Description

APIChatGPT
CEO
Timothy Archer
Full Time Employees
18,600
Sector
Technology
Industry
Semiconductors
Address
4650 Cushing Parkway Fremont CA United States of America 94538
IPO Date
May 4, 1984
Business
Lam Research Corporation (Nasdaq: LRCX) designs, manufactures, markets, refurbishes and services semiconductor processing equipment used in the fabrication of integrated circuits worldwide. The company supplies wafer fabrication equipment and related services primarily for front-end wafer processing steps that create active components such as transistors and capacitors, along with interconnects; its core product portfolio encompasses market-leading solutions for thin film deposition, including atomic layer deposition; plasma etch, featuring platforms like Sense.i and Transformer Coupled Plasma technology; photoresist strip; and wafer cleaning processes, which support advanced memory, packaging structures, microelectromechanical systems (MEMS), light-emitting diodes (LEDs), sensors, transducers, analog and mixed signal devices, discretes, power devices, optoelectronics and photonics. Lam Research also offers high-precision mass metrology systems for advanced process monitoring and control, as well as ValuePoint Optimized Productivity Services to optimize customer equipment sets throughout product cycles; these technologies enable chipmakers to produce smaller, higher-performance devices for artificial intelligence, high-performance computing and other applications. Founded in 1980 by David K. Lam and headquartered in Fremont, California, the company operates globally with offices, manufacturing facilities and customer support across North America, Asia, Europe and other regions, serving leading semiconductor manufacturers including logic, memory producers and foundries. In September 2025, Lam Research entered into a non-exclusive cross-licensing and collaboration agreement with JSR Corporation and its subsidiary Inpria Corporation to accelerate next-generation patterning technologies, including dry resist for extreme ultraviolet (EUV) lithography via its Aether platform, metal oxide resists, high NA EUV patterning for advanced nodes, and new materials for atomic layer etching and deposition; this partnership builds on prior acquisitions like Novellus Systems in 2012 to expand etch, deposition and advanced packaging capabilities. In November 2025, the company deepened its investment in the Silicon Forest region to bolster semiconductor industry leadership amid the AI era, reflecting ongoing strategic expansions in operations and technology innovation.

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